Chitsulo Chosapanga dzimbiri cha Aluminiyamu Chapamwamba cha SPHC SPCC Mapepala a Metal Stamping Part

Njira zotsatirazi nthawi zambiri zimaphatikizidwa mu ndondomeko ya okosijeni:
1. Kudyetsa zopangira: Gwiritsani ntchito mapaipi kuti mupereke zida ku riyakitala kuti musunge bwino zinthu zopangira mkati.
2. Zochita: Kuti mugwiritse ntchito makutidwe ndi okosijeni, onjezani mpweya ku riyakitala ndikuwongolera momwe zimayendera (monga kutentha, kuthamanga, ndi nthawi yochitira).
3. Kulekanitsa katundu: Gwiritsani ntchito choziziritsira mpweya kuziziritsa zinthu zomwe zachitika, kutembenuza kuchokera ku mpweya kukhala wamadzimadzi kapena olimba, kenako gwiritsani ntchito cholekanitsa kuti mulekanitse zinthu zochokera kuzinthu zosiyanasiyana.
4. Kuyeretsedwa: Kuonetsetsa kuti zomwe zimapangidwira zikufika pachiyero chofunikira, yeretsani.

5. Kupaka: Zogulitsazo zikatsukidwa, zimayikidwa motsatira malangizo ndi miyezo musanagulitsidwe kwa makasitomala kapena kutumizidwa ku gawo lotsatira la kukonza.
Muzinthu zina zapadera, monga kupanga semiconductor wafer, njira yopangira okosijeni imaphatikizapo kugwiritsa ntchito mphamvu ya kutentha ndi okosijeni (oxygen ndi madzi) ku gawo lapansi la silicon kuti apange zokutira za silicon dioxide (SiO2).Kanema wa oxide uyu amagwira ntchito ngati anti-etching wosanjikiza kuti ateteze chowotchacho kuti chisalowerere mosadziwa panthawi ya etching, imayimitsa kufalikira panthawi yoyika ma ion, ndikuletsa kutayikira kwapano kuti zisadutse mabwalo.